Surface Mount Device Package Types

Surface mount device package types soic package.

Surface mount device package types.

Micro surface mount device extended technology. Ceramic pin grid array cpga graphic cqfp. Chip array small scale ball grid array cbga. Ceramic flat pack clga.

There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below. Surface mount device package types. It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. Concurrently as the device complexity increases the heat generated by operation.

The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame. Bump chip carrier bga. Ceramic land grid array see lga cpga.

Ceramic ball grid array cfp. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases. A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process.

Bumpered quad flat pack cabga ssbga. A very large number of different types of package exist.